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Cumsumi Semiconductor International (CSI ) is a joint venture established by Taiwan Make Chance Corp. and Shanghai Jinquan Electronic Technology Co.,Ltd. CSI is a multinational company engaged in the devising, exploiting and producing a broad range of semiconductor components. The main products include complete series diodes/rectifiers with GPP technology,MOSFETS and all kinds of wafers. The wafers of schottky barrier rectifiers and MOSFETS produced in the Philippines.The manufacturer of GPP(Glass Passivated Junction) Cumsumi Semiconductor International (CSI ) is a joint venture established by Taiwan Make Chance Corp. and Shanghai Jinquan Electronic Technology Co.,Ltd. CSI is a multinational company engaged in the devising, exploiting and producing a broad range of semiconductor components. The main products include complete series diodes/rectifiers with GPP technology,MOSFETS and all kinds of wafers. The wafers of schottky barrier rectifiers and MOSFETS produced in the Philippines.The manufacturer of GPP(Glass Passivated Junction)

For our chips to maintain high quality and high reliability after packaging, Cumsumi we cooperate with Tayomi Technology to engage in the production of Discrete Components. In maintenance of finished product stability, our subcontractors must be ISO9001, QS9000 and ISO14000 accredited. To further insure product quality, we send resident inspector to examine all products and ship part of them to the original factory for inspection.

With the R&D of many package finished, and quantity production in progress, including the whole series from SOD-723 to TO-3P, we are confident to provide the highest-quality and satisfaction required by our customers.

Molestones

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During recent years, Cumsumi never ceased the research and development of new products:

1998. TVS 5.0V developed and implemented mass production.

1999. TVS 3.3V developed and implemented mass production.

2000. Schottky LOW VF developed

2001. Super fast chip Trr < 25ns developed

2001. Implemented mass production of Schottky LOW VF and Super fast.

For the application of Schottky LOW VF product and LOW EMI/EMC, the electric consumption of electronic product can be

reduced significantly, consequently, the use time of mobile electronic products has increased 30%.

2002. Schottky 150V developed

2002. Super fast single chip Io>30A developed.

2003. Schottky 200V developed

2004. Quantity production of Schottky 200V and LOW EMI/EMC

2005. SOD-723 package small signal schottky developed and implemented mass production.

2006. Sintered Glass Rectifiers developed and glass sealed junction with epoxy over mold.

2006. Moly/silicon/glass combination minimize the effect of thermal and mechanical stress.

More new products taking leading position will definitely be researched and developed in the future and then put into quantity production.

Production philosophy

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This website contains virtually all the product families including Standard, Fast Recovery, Schottky, Ultra-Fast, TVS, Bridges, and the ultimate in cost/performance...the high temperature glass sintered . Surface Mount Devices (SMD) are greatly expanded within each of the above product families. Our products are recognized for their quality and reliability in the automotive industry, telecommunications industry, computer applications, home appliance, lighting apparatus and general electrical industrial applications.

Although every effort has been made to ensure accuracy and completeness, the evolving technology in the industry may require, from time to time, changes in the information contained herein. CSI reserves the right to change data without notice to improve products performance, reliability, quality, functionality and cost.